Work 版 (精华区)
发信人: lgang (闲云野鹤), 信区: Work
标 题: 威盛电子2007校园招聘职位、网申及宣讲会
发信站: BBS 哈工大紫丁香站 (Wed Sep 27 14:11:43 2006)
标 题: 威盛电子2007校园招聘职位、网申及宣讲会
发信站: 日月光华 (2006年09月27日14:14:09 星期三)
http://yingjiesheng.com/news/8229c576f682369a/59de104dfaeff17fcaa4120575bb45c8.html
来自ChinaHR.COM的消息
公司简介
威盛电子(VIA Technologies Inc.),世界知名的集成电路(IC)设计与个人电脑平台解
决方案领导厂商,在整个半导体产业链中,威盛电子因其无晶圆厂的经营模式,加上重视
人才培养与技术研发,成为知识经济时代的企业典范。1998年以来,经过与Cyrix,IDT C
enter,S3,IC Ensemble等数项重大的并购与合资案,威盛电子已由过去单纯的系统芯片
组厂商,升级成为全方位的网络系统整合组件供应商。产品线除了跨平台的系统芯片、光
存储、音效视讯多媒体控制芯片及Windows CE相关的嵌入式系统产品等等;同时藉由与S3
的策略合作,威盛已掌握先进的绘图芯片技术,并且在取得LSI Logic的无线通讯设计团队
后,大步跨入无线通讯领域,未来将可能拥有建构个人计算机、网络装置及信息家电所需
的完整实力,威盛电子总部位于台北,在美国、欧洲及中国大陆等地设有分支机构,员工
人数超过3500人,其中超过75%为研发工程师。
网上申请:从2006年9月26号开始简历投递;
简历筛选:同时,威盛HR部门进行简历筛选;
笔试:10月底进行全国同步笔试;
面试:之后分别在各高校进行面试,同时伴有校园宣讲会;
录用:面试合格后,发放录用通知。
校园宣讲会
北京站: 清华大学,北京邮电大学,北京航空航天大学
天津站: 天津大学
哈尔滨站: 哈尔滨工业大学
西安站: 西安交通大学,西安电子科技大学
成都站: 成都电子科技大学
合肥站: 中国科学技术大学
武汉站: 华中科技大学,武汉大学
南京站: 东南大学
上海站: 上海交通大学
杭州站: 浙江大学
广州站: 华南理工大学
注:宣讲将于10月中旬进行,具体时间待定。
北京公司 | 招聘职位
职位名称 招聘部门
Logic Design Engineer System Logic
IC Design Automation Engineer System Logic
Hardware System Engineer System Logic
上海公司 | 招聘职位
职位名称 招聘部门
Architecture Design Engineer S3Graphics Hardware
ASIC Design Engineer S3Graphics Hardware
IC Physical Design Engineer S3Graphics Hardware
System Engineer S3Graphics Hardware
Software Engineer(Graphics Device Driver Develop) S3Graphics Software
Software Engineer(3D Graphics Device Driver Develop) S3Graphics Software
Software Engineer(OpenGL Graphics Device Driver Develop) S3Graphics Software
Software Engineer(Video Device Driver Develop) S3Graphics Software
Software Engineer(Multimedia Driver Develop) S3Graphics Software
Software Engineer(Compiler Develop) S3Graphics Software
Software Engineer(Application Develop) S3Graphics Software
Software Engineer(Linux device driver Develop) S3Graphics Software
Software Engineer(Video BIOS Develop) S3Graphics Software
Software Quality Assurance Engineer(Game Tester) S3Graphics Software
Software Quality Assurance Engineer S3Graphics Software
PM Engineer (Project Management Engineer) VIA Embedded Platform
QA Engineer(Quality Assurance Engineer) VIA Embedded Platform
TSV Engineer(Technical Support and Validation Engineer) VIA Embedded Platfor
m
Embedded Engineer (WinCE Multimedia Development) VIA Embedded Platform
Embedded Engineer (Security software development) VIA Embedded Platform
Embedded Engineer (System on Chip software development) VIA Embedded Platform
Embedded Engineer (CODEC development) VIA Embedded Platform
Embedded Engineer ( Linux SDK development) VIA Embedded Platform
Embedded Engineer( Linux driver development) VIA Embedded Platform
Embedded Engineer(WinCE driver development) VIA Embedded Platform
Product Engineer Manufacturing & Production Engineering
深圳公司 | 招聘职位
职位名称 招聘部门
Software Development Engineer Networking Technology
Project Coordinator Mobile Communication
Layout Engineer Mobile Communication
Mechanical Design Engineer Mobile Communication
Industry Design Engineer Mobile Communication
Software Application Engineer Mobile Communication
Hardware Application Engineer Mobile Communication
杭州公司 | 招聘职位
职位名称 招聘部门
Wireless Protocol Software Engineer VIA-Telecom
Mobile Application Software Engineer VIA-Telecom
Software Development Engineer VIA-Software
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※ 修改:·lgang 於 Sep 27 14:11:52 2006 修改本文·[FROM: 202.120.202.48]
※ 来源:·哈工大紫丁香 http://bbs.hit.edu.cn·[FROM: 202.120.202.48]
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